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Boyd 534202B02853G

About The 97mm; External Length - Metric:12.4°C/W; Packages Cooled:TO-220; External Width - Metric:25

HEAT SINK; Thermal Resistance:13.4°C/W; Packages Cooled:TO-220; External Width - Metric:25.4mm; External Height - Metric:29.97mm; External Length - Metric:12.7mm; External Diameter - Metric:-; Heat Sink Material:Aluminium

Cooling & Thermal Management

Boyd 534202B02853G

Cooling & Thermal Management

Specifications of Boyd 534202B02853G

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Boyd 534202B02853G
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Rating :- 9.92 /10
Votes :- 50
of Supervisors / Monitors:1Monitors; Supply Voltage Min:1V; Supply Voltage Max:5.5V; Reset Type:Active-Low; Digital IC Case:SOT-23; No.

of Supervisors / Monitors:1Monitors; Supply Voltage Min:1V; Supply Voltage Max:5.5V; Reset Type:Active-Low; Digital IC Case:SOT-23; No.

5V IC, SUPERVISOR, ACTIVE LOW, SOT23-3; Threshold Voltage:4. Microchip Mcp100T-485I/tt.of Pins:3Pins; Delay Time:350ms; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; Product Range:-; Automotive Qualification Standard:AEC-Q100; RoHS Phthalates Compliant:Yes; MSL:MSL 1 - Unlimited; SVHC:No SVHC (27-Jun-2018); Base Number:100; Operating Temperature Range:-40°C to +85°C; Supply Current:45µA; Supply Voltage Range:1V to 5.

  • Eletrônicos
  • Componentes e placas de circuitos
  • Semicondutores
  • Semiconductors - ICs
  • MICROCHIP
    • of Supervisors / Monitors:1Monitors; Supply Voltage Min:1V; Supply Voltage Max:5.5V; Reset Type:Active-Low; Digital IC Case:SOT-23; No.

    of Supervisors / Monitors:1Monitors; Supply Voltage Min:1V; Supply Voltage Max:5.5V; Reset Type:Active-Low; Digital IC Case:SOT-23; No.

    of Pins:3Pins; Delay Time:350ms; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; Product Range:-; Automotive Qualification Standard:AEC-Q100; RoHS Phthalates Compliant:Yes; MSL:MSL 1 - Unlimited; SVHC:No SVHC (27-Jun-2018); Base Number:100; Operating Temperature Range:-40°C to +85°C; Supply Current:45µA; Supply Voltage Range:1V to 5.625V; No.

  • Eletrônicos
  • Componentes e placas de circuitos
  • Semicondutores
  • Semiconductors - ICs
  • MICROCHIP
    • HEAT SINK; Thermal Resistance:6.8°C/W; Packages Cooled:TO-220; External Width - Metric:44.5mm; External Height - Metric:36.83mm; External Length - Metric:36.8mm; External Diameter - Metric:-; Heat Sin 99R8257
  • Eletrônicos
  • Cooling & Thermal Management
  • BOYD
    • HEAT SINK; Thermal Resistance:23.2°C/W; Packages Cooled:TO-220; External Width - Metric:21.84mm; External Height - Metric:19.05mm; External Length - Metric:10.03mm; External Diameter - Metric:-; Heat Sink Material:Aluminium
  • Eletrônicos
  • Cooling & Thermal Management
  • BOYD
    • HEAT SINK; Thermal Resistance:23.2°C/W; Packages Cooled:TO-220; External Width - Metric:21.84mm; External Height - Metric:19.05mm; External Length - Metric:10.03mm; External Diameter - Metric:-; Heat Sink Material:Aluminium
  • Eletrônicos
  • Cooling & Thermal Management
  • BOYD