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MULTICOMP PRO

Multicomp Pro 3-38-32Gfn

About The BUSH, TO-3, PK10; Insulator Body Material:Nylon (Polyamide); Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; SVHC:No SVHC (27-Jun-2018); External Depth:4.37mm; External Diameter:6

BUSH, TO-3, PK10; Insulator Body Material:Nylon (Polyamide); Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; SVHC:No SVHC (27-Jun-2018); External Depth:4.37mm; External Diameter:6.1mm; Length:4.37mm; Material:Nylon; Overall Width:6.1mm; Packages Cooled:TO-3; Type:Bush

Cooling & Thermal Management

Multicomp Pro 3-38-32Gfn

More from BUSH, TO-3, PK10; Insulator Body Material:Nylon (Polyamide); Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; SVHC:No SVHC (27-Jun-2018); External Depth:4.37mm; External Diameter:6.1mm; Length:4.37mm; Material:Nylon; Overall Width:6.1mm; Packages Cooled:TO-3; Type:Bush | MULTICOMP PRO
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Cooling & Thermal Management

Specifications of Multicomp Pro 3-38-32Gfn

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Multicomp Pro 3-38-32Gfn
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SIL-PAD, K-10, .006", TO-220; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:1.3W/m.K; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:10ohm-m; Thermal Impedance:0.86°C/W; Dielectric S
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    • RES, THIN FILM, 4K02, 0.5%, 0.063W, 0603; Resistance:4.02kohm; Resistance Tolerance:± 0.5%; Power Rating:63mW; Resistor Case / Package:0603 ^1608 Metric]; Resistor Technology:Thin Film; Resistor Type: 28K0707
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    • GAP PAD VO, .080", 4"X4" SHEET; Thermal Conductivity:0.8W/m.K; Conductive Material:-; Thickness:2mm; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:100mm; Product Range:-; SVHC:No SVHC (27-Jun-2018); Breakdown Voltage Vbr:6kV; Dielectric Constant:5.5; Electrical Property Ins / Con:Insulative; External Depth:2mm; External Length / Height:100mm; Insulator Body Material:Gap Pad VO; Length:100mm; Material:Gap Pad VO; Operating Temperature Max:200°C; Operating Temperature Min:-60°C; Operating Temperature Range:-60°C to +200°C; Overall Width:100mm; Thermal Conductivity (Cal/cm³/K):0.8Cal/cm³/K; Type:Thermal Pad; Volume Resistivity:100000Mohm-m
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  • Cooling & Thermal Management
  • BERGQUIST
    • RES, THIN FILM, 330R, 0.5%, 0.063W, 0603; Resistance:330ohm; Resistance Tolerance:± 0.5%; Power Rating:63mW; Resistor Case / Package:0603 ^1608 Metric]; Resistor Technology:Thin Film; Resistor Type:Pr 28K0659
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  • Componentes e placas de circuitos
  • Componentes de circuito passivo
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  • Passive Components
  • SUSUMU
    • RES, THIN FILM, 330R, 0.5%, 0.063W, 0603; Resistance:330ohm; Resistance Tolerance:± 0.5%; Power Rating:63mW; Resistor Case / Package:0603 ^1608 Metric]; Resistor Technology:Thin Film; Resistor Type:Pr 28K0659
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  • Componentes e placas de circuitos
  • Componentes de circuito passivo
  • Resistores
  • Passive Components
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