Boyd 322505B00000G
About The 05Mm; Heat Sink Mater 89K0319 |BOYD 322505B00000G.Heat Sink; Thermal Resistance:56°C/W; Packages Cooled:To-5; External Width - Metric:-; External Height - Metric:10
Heat Sink; Thermal Resistance:56°C/W; Packages Cooled:To-5; External Width - Metric:-; External Height - Metric:10.16Mm; External Length - Metric:-; External Diameter - Metric:19.05Mm; Heat Sink Mater 89K0319 ,BOYD 322505B00000G
Gestione di calore e raffreddamento
Boyd 322505B00000G
Gestione di calore e raffreddamento
Specifications of Boyd 322505B00000G | |
|---|---|
| Category | Dispositivi elettronici > Accessori dispositivi elettronici > Componenti per computer > Componenti di raffreddamento per PC |
| Instock | instock |
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![Grano Chip, 0,07 Ohm, 2,5A, 0603; Modello Case Ferrite:0603 [1608 Metrico]; Impedenza @ 100Mhz:120Ohm; Intervallo Corrente Cc:2.5A; Gamma Prodotti:Serie Mfb; Resistenza Cc Max:0.07Ohm; Tolleranza Impedenza:± 25%; Standar |MEC MARCOM MFB-160808-0120PP](/op/android/logo.png){kind=logo}