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Boyd 416601U00000G

About The ; Thermal Resistance:0.4mm; External Length - Metric:305mm; External Diameter - Metric:-; Heat Sink Material:Aluminium, Copper; External Width - Imperial:5"; External Height - Imperial:0

LIQUID COLD PLATE; Thermal Resistance:0.; Thermal Resistance:0.005°C/W; Packages Cooled:-; External Width - Metric:127mm; External Height - Metric:17.4mm; External Length - Metric:305mm; External Diameter - Metric:-; Heat Sink Material:Aluminium, Copper; External Width - Imperial:5"; External Height - Imperial:0.69"; External Length - Imperial:12"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2019)

Cooling & Thermal Management

Boyd 416601U00000G

HEAT SINK BGA 27 X 27 X 18 WITH PAD; Thermal Resistance:20.3°C/W; Packages Cooled:BGA; External Width - Metric:27mm; External Height - Metric:18mm; External Length - Metric:27mm; External Diameter - Metric:-; Heat Sink Material:Aluminium; External Width - Imperial:1.06"; External Height - Imperial:0.71"; External Length - Imperial:1.06"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2018)
HEAT SINK BIG CHIEF TO247/218; Thermal Resistance:6.26°C/W; Packages Cooled:TO-218, TO-247; External Width - Metric:35mm; External Height - Metric:35mm; External Length - Metric:22mm; External Diameter - Metric:-; Heat Sink Material:-; External Width - Imperial:1.38"; External Height - Imperial:1.38"; External Length - Imperial:0.87"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2019)
More from LIQUID COLD PLATE; Thermal Resistance:0.; Thermal Resistance:0.005°C/W; Packages Cooled:-; External Width - Metric:127mm; External Height - Metric:17.4mm; External Length - Metric:305mm; External Diameter - Metric:-; Heat Sink Material:Aluminium, Copper; External Width - Imperial:5"; External Height - Imperial:0.69"; External Length - Imperial:12"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2019) | BOYD
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Cooling & Thermal Management

Specifications of Boyd 416601U00000G

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Boyd 416601U00000G
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Rating :- 9.92 /10
Votes :- 53
EDGING GROMMET, 1MM, 10M; Grommet Type:Solid Edging; Cable Diameter Min:-; Cable Diameter Max:-; Grommet Material:PE (Polyethylene); Mounting Hole Dia:-; Panel Thickness Max:1mm; Grommet Colour:Natural; Product Range:-; SVHC:No SVHC (17-Dec-2015); Accessory Type:Grommet; Body Material:PE (Polyethylene); Colour:Natural; External Width:3.6mm; Material:PE; Reel Length (Imperial):33ft; Reel Length (Metric):10m
  • Eletrônicos
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  • MULTICOMP PRO
    • of Timers:4; Operating Temperature Max:85°C; Operating Temperature Min:-40°C; Operating Temperature Range:-40°C to +85°C; Oscillator Type:External, Internal; Peripherals:ADC, Comparator, PWM, RTC, Timer; Program Memory Size:128KB; Supply Voltage Range:2.7V to 5.5V; Termination Type:Surface Mount Device

    of Timers:4; Operating Temperature Max:85°C; Operating Temperature Min:-40°C; Operating Temperature Range:-40°C to +85°C; Oscillator Type:External, Internal; Peripherals:ADC, Comparator, PWM, RTC, Timer; Program Memory Size:128KB; Supply Voltage Range:2.7V to 5.5V; Termination Type:Surface Mount Device

    7V; Supply Voltage Max:5. MCU, 8BIT, ATMEGA, 16MHZ, QFN-64; Product Range:AVR ATmega Family ATmega128 Series Microcontrollers; CPU Speed:16MHz; Program Memory Size:128KB; RAM Memory Size:4KB; No.. of PWM Channels:8; No.

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  • MICROCHIP
    • of Timers:4; Operating Temperature Max:85°C; Operating Temperature Min:-40°C; Operating Temperature Range:-40°C to +85°C; Oscillator Type:External, Internal; Peripherals:ADC, Comparator, PWM, RTC, Timer; Program Memory Size:128KB; Supply Voltage Range:2.7V to 5.5V; Termination Type:Surface Mount Device
  • Eletrônicos
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  • Semiconductors - ICs
  • MICROCHIP
    • HEAT SINK MAX CLIP - STANDARD 100MM; Thermal Resistance:3.03°C/W; Packages Cooled:TO-218, TO-220, TO-251, TO-262, TO-273; External Width - Metric:30mm; External Height - Metric:45mm; External Length - Metric:100mm; External Diameter - Metric:-; Heat Sink Material:-; External Width - Imperial:1.18"; External Height - Imperial:1.77"; External Length - Imperial:3.94"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2019)
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    • HEAT SINK MAX CLIP - STANDARD 140MM; Thermal Resistance:1.21°C/W; Packages Cooled:TO-218, TO-220, TO-251, TO-262, TO-273; External Width - Metric:73.54mm; External Height - Metric:60mm; External Length - Metric:140mm; External Diameter - Metric:-; Heat Sink Material:-; External Width - Imperial:2.9"; External Height - Imperial:2.36"; External Length - Imperial:5.51"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2019)
  • Eletrônicos
  • Cooling & Thermal Management
  • BOYD
    • HEAT SINK BIG CHIEF TO247/218; Thermal Resistance:6.26°C/W; Packages Cooled:TO-218, TO-247; External Width - Metric:35mm; External Height - Metric:35mm; External Length - Metric:22mm; External Diameter - Metric:-; Heat Sink Material:-; External Width - Imperial:1.38"; External Height - Imperial:1.38"; External Length - Imperial:0.87"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2019)
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  • Cooling & Thermal Management
  • BOYD
    • LIQUID COLD PLATE; Thermal Resistance:0.; Thermal Resistance:0.005°C/W; Packages Cooled:-; External Width - Metric:127mm; External Height - Metric:17.4mm; External Length - Metric:305mm; External Diameter - Metric:-; Heat Sink Material:Aluminium, Copper; External Width - Imperial:5"; External Height - Imperial:0.69"; External Length - Imperial:12"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2019)
  • Eletrônicos
  • Cooling & Thermal Management
  • BOYD
    • HEAT SINK BGA 27 X 27 X 18 WITH PAD; Thermal Resistance:20.3°C/W; Packages Cooled:BGA; External Width - Metric:27mm; External Height - Metric:18mm; External Length - Metric:27mm; External Diameter - Metric:-; Heat Sink Material:Aluminium; External Width - Imperial:1.06"; External Height - Imperial:0.71"; External Length - Imperial:1.06"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2018)
  • Eletrônicos
  • Cooling & Thermal Management
  • BOYD
    • LIQUID COLD PLATE; Thermal Resistance:0.; Thermal Resistance:0.005°C/W; Packages Cooled:-; External Width - Metric:127mm; External Height - Metric:17.4mm; External Length - Metric:305mm; External Diameter - Metric:-; Heat Sink Material:Aluminium, Copper; External Width - Imperial:5"; External Height - Imperial:0.69"; External Length - Imperial:12"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2019)
  • Eletrônicos
  • Cooling & Thermal Management
  • BOYD
    • HEAT SINK BGA 27 X 27 X 18 WITH PAD; Thermal Resistance:20.3°C/W; Packages Cooled:BGA; External Width - Metric:27mm; External Height - Metric:18mm; External Length - Metric:27mm; External Diameter - Metric:-; Heat Sink Material:Aluminium; External Width - Imperial:1.06"; External Height - Imperial:0.71"; External Length - Imperial:1.06"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2018)
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