Roth Elektronik Re931

Rating :- 9.96 /10

Votes :- 54

of Copper Coated Sides:1; No.

54mm; Row Pitch:2.54MM; Board Type:Eurocard; Board Material:Epoxy Glass Composite; Hole Diameter:1mm; External Height:100mm; External Width:160mm; Board Thickness:1.5mm; SVHC:No SVHC (15-Jan-2019); Board Connector / Footprint:DIN41612 Type C; Copper Coating Density:HAL 5 - 6 Âµm (hole 2 - 3 Âµm); Copper Thickness:35Âµm; External Length / Height:100mm; Hole Matrix:38 x 61; Hole Pitch:2.

of Copper Coated Sides:1; No.

54MM; Board Type:Eurocard; Board Material:Epoxy Paper; Hole Diameter:1mm; External Height:100mm; External Width:160mm; Board Thickness:1.of Holes:2109; PCB Size:100 x 160 mm; Pitch Spacing:2.

of Copper Coated Sides:1; No.

54MM; Board Type:Eurocard; Board Material:Epoxy Glass Composite; Hole Diameter:1mm; External Height:100mm; External Width:160mm; Board Thickness:1.

of Copper Coated Sides:1; No.

54mm PCB, EUROCARD, FR2, 100X160; Board Type:Eurocard; Board Material:Epoxy Paper; Hole Diameter:1mm; External Height:100mm; External Width:160mm; Board Thickness:1.

of Copper Coated Sides:2; No.

35mm; External Height:100mm; External Width:160mm; Board Thickness:1.27mm; Material:Epoxy FR4; No.

Au 0.08 - 0.1 Âµm; Copper Thickness:35Âµm; External Height:58.9mm; External Length / Height:58.9mm; External Width:120.1mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No.

5mm MULITADAPTOR, SMD, FR4, TSSOP; Convert From:-; Convert To:-; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:-; SVHC:No SVHC (15-Jan-2019); Board Connector / Footprint:TSSOP; Board Material:Epoxy Glass Composite; Board Thickness:1.of Copper Coated Sides:2; PCB Size:58.1; Pad Area:1.

Au 0.08 - 0.1 Âµm; Copper Thickness:35Âµm; External Height:61.4mm; External Length / Height:61.4mm; External Width:81.7mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No.

5mm MULTIADAPTOR, SMD, FR4, SSOP; Convert From:-; Convert To:-; Pitch Spacing:2.70 mm; Pad Area:1.50 mm Ã; Pad Diameter:1.

Au 0.08 - 0.1 Âµm; Copper Thickness:35Âµm; External Height:57.2mm; External Length / Height:57.2mm; External Width:57.2mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxy FR4; No.

54mm; Row Pitch:2.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem.50 mm Ã; Pad Diameter:1.

Au 0.08 - 0.1 Âµm; Copper Thickness:35Âµm; External Height:61.4mm; External Length / Height:61.4mm; External Width:81.7mm; Hole Diameter:1mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No.

54mm; Row Pitch:-; Product Range:-; SVHC:No SVHC (15-Jan-2019); Board Connector / Footprint:SSOP; Board Material:Epoxy Glass Composite; Board Thickness:1. Roth Elektronik Re931.5mm; Board Type:SMD Device Adapter; Copper Coating Density:chem.of Copper Coated Sides:2; PCB Size:61.