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Bergquist Sil Pad Tsp 900

About The 82°C/W; Dielectric Strength.9W/m

SIL-PAD 400, .007", TO-220, PK10; Insulator Body Material:Carbon; Thermal Conductivity:0.9W/m.K; Breakdown Voltage Vbr:3.5kV; Thickness:0.178mm; Volume Resistivity:10ohm-m; Thermal Impedance:1.82°C/W; Dielectric Strength

Cooling & Thermal Management

Bergquist Sil Pad Tsp 900

SIL-PAD 900S, .009", TO-3P, PK10; Insulator Body Material:Fibreglass, Silicone Rubber; Thermal Conductivity:1.6W/m.K; Breakdown Voltage Vbr:5.5VAC; Thickness:228.6µm; Volume Resistivity:10ohm-m; Thermal Impedance:0.95°C/W; Dielectric Strength:-; Product Range:-; SVHC:No SVHC (27-Jun-2018); External Depth:0.2mm; Operating Temperature Max:180°C; Operating Temperature Min:-60°C; Operating Temperature Range:-60°C to +180°C; Packages Cooled:TO-218, TO-220, TO-247; Type:Thermal Pad
SIL-PAD 400, .007", 12"X12"SHEET; Insulator Body Material:Fibreglass, Silicone Rubber; Thermal Conductivity:0.9W/m.K; Breakdown Voltage Vbr:4.5kV; Thickness:177.8µm; Volume Resistivity:10ohm-m; Thermal Impedance:1.82°C/
More from Eletrônicos: SIL-PAD 400, .007", TO-220, PK10; Insulator Body Material:Carbon; Thermal Conductivity:0.9W/m.K; Breakdown Voltage Vbr:3.5kV; Thickness:0.178mm; Volume Resistivity:10ohm-m; Thermal Impedance:1.82°C/W; Dielectric Strength
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Cooling & Thermal Management

Specifications of Bergquist Sil Pad Tsp 900

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Bergquist Sil Pad Tsp 900
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BOND-PLY 100, .005", 1"X1", PK10; Thermal Conductivity:0.8W/m.K; Conductive Material:-; Thickness:0.005"; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:25mm; Product Range:-; SVHC:No SVHC
  • Eletrônicos
  • Cooling & Thermal Management
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    • BOND-PLY 100, .005", 12"X12" SHEET; Thermal Conductivity:0.8W/m.K; Conductive Material:-; Thickness:0.005"; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:300mm; Product Range:-; SVHC:No SVHC (27-Jun-2018); Breakdown Voltage Vbr:3000V; Colour:White; External Depth:0.127mm; External Length / Height:300mm; Height:300mm; Insulator Body Material:Carbon; Length:300mm; Operating Temperature Max:120°C; Operating Temperature Min:-30°C; Operating Temperature Range:-30°C to +120°C; Overall Width:300mm; Packages Cooled:TO-220; Resistivity:200ohm/sq; Tensile Strength N/m²:6N/mm²; Thermal Conductivity (Cal/cm³/K):0.8W/m.K; Type:Adhesive Tape; Volume Resistivity:100000000000ohm-m
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    • BOND-PLY 100, .005", 6"X6" SHEET; Insulator Body Material:Carbon; Thermal Conductivity:0.8W/m.K; Breakdown Voltage Vbr:3kV; Thickness:0.127mm; Volume Resistivity:100000000000ohm-m; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; SVHC:No SVHC (27-Jun-2018); Colour:White; External Depth:0.127mm; External Length / Height:150mm; External Width:150mm; Height:150mm; Length:150mm; Operating Temperature Max:120°C; Operating Temperature Min:-30°C; Operating Temperature Range:-30°C to +120°C; Overall Width:150mm; Packages Cooled:TO-220; Resistivity:200ohm/sq; Tensile Strength N/m²:6N/mm²; Thermal Conductivity (Cal/cm³/K):0.8W/m.K; Type:Adhesive Tape
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    • HI-FLOW 300P, .0015", 4"X4" SHEET; Thickness:0.102mm; Conductive Material:-; Thermal Conductivity:0.9W/m.K; Thermal Impedance:0.13°C/W; Volume Resistivity:10ohm-m; External Length:100mm; External Width:100mm; Product Range:-; SVHC:No SVHC (27-Jun-2018); Breakdown Voltage Vbr:300VAC; Colour:Green; Dielectric Constant:3.2; Flammability Rating:UL94V-0; Operating Temperature Max:130°C; Operating Temperature Min:-30°C; Packages Cooled:TO-220; Type:Adhesive Sheet
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    • SIL-PAD A1500, .010", 4"X4" SHEET; Thickness:0.2mm; Conductive Material:Silicone, Fibreglass; Thermal Conductivity:2W/m.K; Thermal Impedance:-; Volume Resistivity:100000Mohm-m; External Length:100mm; External Width:100mm; Product Range:-; SVHC:No SVHC (27-Jun-2018); Breakdown Voltage Vbr:6000V; Operating Temperature Range:-60°C to +180°C; Packages Cooled:TO-220; Type:Thermal Pads
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  • Cooling & Thermal Management
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    • SIL-PAD 400, .007", 12"X12"SHEET; Insulator Body Material:Fibreglass, Silicone Rubber; Thermal Conductivity:0.9W/m.K; Breakdown Voltage Vbr:4.5kV; Thickness:177.8µm; Volume Resistivity:10ohm-m; Thermal Impedance:1.82°C/
  • Eletrônicos
  • Cooling & Thermal Management
  • BERGQUIST
    • SIL-PAD 400, .007", TO-220, PK10; Insulator Body Material:Carbon; Thermal Conductivity:0.9W/m.K; Breakdown Voltage Vbr:3.5kV; Thickness:0.178mm; Volume Resistivity:10ohm-m; Thermal Impedance:1.82°C/W; Dielectric Strength
  • Eletrônicos
  • Cooling & Thermal Management
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    • SIL-PAD 900S, .009", TO-3P, PK10; Insulator Body Material:Fibreglass, Silicone Rubber; Thermal Conductivity:1.6W/m.K; Breakdown Voltage Vbr:5.5VAC; Thickness:228.6µm; Volume Resistivity:10ohm-m; Thermal Impedance:0.95°C/W; Dielectric Strength:-; Product Range:-; SVHC:No SVHC (27-Jun-2018); External Depth:0.2mm; Operating Temperature Max:180°C; Operating Temperature Min:-60°C; Operating Temperature Range:-60°C to +180°C; Packages Cooled:TO-218, TO-220, TO-247; Type:Thermal Pad
  • Eletrônicos
  • Cooling & Thermal Management
  • BERGQUIST
    • SIL-PAD 400, .007", TO-220, PK10; Insulator Body Material:Carbon; Thermal Conductivity:0.9W/m.K; Breakdown Voltage Vbr:3.5kV; Thickness:0.178mm; Volume Resistivity:10ohm-m; Thermal Impedance:1.82°C/W; Dielectric Strength
  • Eletrônicos
  • Cooling & Thermal Management
  • BERGQUIST
    • SIL-PAD 900S, .009", TO-3P, PK10; Insulator Body Material:Fibreglass, Silicone Rubber; Thermal Conductivity:1.6W/m.K; Breakdown Voltage Vbr:5.5VAC; Thickness:228.6µm; Volume Resistivity:10ohm-m; Thermal Impedance:0.95°C/W; Dielectric Strength:-; Product Range:-; SVHC:No SVHC (27-Jun-2018); External Depth:0.2mm; Operating Temperature Max:180°C; Operating Temperature Min:-60°C; Operating Temperature Range:-60°C to +180°C; Packages Cooled:TO-218, TO-220, TO-247; Type:Thermal Pad
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  • Cooling & Thermal Management
  • BERGQUIST