Molex 505476-0810

of Bits:32bit; CPU Speed:48MHz; Program Memory Size:256KB; RAM Memory Size:32KB; No. of I/O's:51I/O's; Embedded Interface Type:I2C, LIN, SPI, UART, USB; Supply Voltage Min:900mV; Supply Voltage Max:1. of Pins:64Pins; MCU Case Style:QFN; No.

of Bits:32bit; CPU Speed:48MHz; Program Memory Size:256KB; RAM Memory Size:32KB; No. of I/O's:51I/O's; Embedded Interface Type:I2C, LIN, SPI, UART, USB; Supply Voltage Min:900mV; Supply Voltage Max:1.MCU, 32BIT, CORTEX-M0+, 48MHZ, TQFP-64; Product Range:SAM32 Family SAM L21 Series Microcontrollers; Architecture:ARM Cortex-M0+; No. of Pins:64Pins; MCU Case Style:TQFP; No.

of Pins:48Pins; MCU Case Style:TQFP; No.MCU, 32BIT, CORTEX-M0+, 48MHZ, TQFP-48; Product Range:SAM32 Family SAM L21 Series Microcontrollers; Architecture:ARM Cortex-M0+; No.2V; MCU Family:SAM32; MCU Series:SAM L21; RoHS Phthalates Compliant:Yes; MSL:MSL 3 - 168 hours; SVHC:No SVHC (27-Jun-2018). of Bits:32bit; CPU Speed:48MHz; Program Memory Size:64KB; RAM Memory Size:8KB; No.

4MM; Pitch Spacing:0.

of Rows:2Rows; Contact Platin MEZZANINE CONN, RCPT, 8POS, 2ROW, 0.4mm; No.4MM; Pitch Spacing:0.

of Rows:1 Row; Contact Plating:Gold Plated Contacts; Contact Material:Phosphor Bronze; FFC/FPC Thickness:0. of Contacts:4Contacts; Gender:Receptacle; Product Range:Easy-On 505110 Series; Contact Termination Type:Surface Mount; Contact Position:Bottom; No.

Molex 505476-0810.4MM; Pitch Spacing:0.4mm; No.

4mm; No.4MM; Pitch Spacing:0.of Rows:2Rows; Contact Platin MEZZANINE CONN, RCPT, 8POS, 2ROW, 0. Molex 505473-0810.

4MM; Pitch Spacing:0. Molex 505476-0810.of Rows:2Rows; Contact Plating:Gold Plat CONNECTOR, PLUG, 4P4S, 2ROW, 0.4mm; No.

Molex 505473-0810.of Rows:2Rows; Contact Platin MEZZANINE CONN, RCPT, 8POS, 2ROW, 0.4mm; No.