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Nxp Spc5775Bdk3Mme2

About The . of I/O's:293I/O's; MCU Case Style:MAPBGA; No

MCU, 32BIT, 220MHZ, MAPBGA-416; Product Range:MPC5xxx Family MPC57xx Series Microcontrollers; Architecture:Power Architecture; MCU Core Size:32bit; Program Memory Size:4MB; RAM Memory Size:512KB; CPU Speed:220MHz; No. of I/O's:293I/O's; MCU Case Style:MAPBGA; No. of Pins:416Pins; Embedded Interface Type:CAN, DSPI, ESCI; MCU Applications:Battery Management; Supply Voltage Min:4.5V; Supply Voltage Max:5.5V; MCU Family:MPC5xxx; MCU Series:MPC57xx; Automotive Qualification Standard:-; MSL:MSL 3 - 168 hours; SVHC:No SVHC (15-Jan-2019)

Semiconductors - ICs

Nxp Spc5775Bdk3Mme2

Semiconductors - ICs

Specifications of Nxp Spc5775Bdk3Mme2

CategoryEletrônicos > Componentes e placas de circuitos > Semicondutores
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Nxp Spc5775Bdk3Mme2
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Rating :- 8 /10
Votes :- 51
CURRENT SENSE RES, 0R002, 5%, 1 W, 1206; Resistance:0.002ohm; Product Range:PML Series; Resistor Case Style:1206 Wide; Power Rating:1W; Resistance Tolerance:± 5%; Resistor Element Material:Metal Strip; Temperature Coefficient:± 150ppm/°C; Automotive Qualification Standard:AEC-Q200; SVHC:No SVHC (27-Jun-2018)
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    • CURRENT SENSE RES, 0R001, 5%, 1 W, 1206; Resistance:0.001ohm; Product Range:PML Series; Resistor Case Style:1206 Wide; Power Rating:1W; Resistance Tolerance:± 5%; Resistor Element Material:Metal Strip; Temperature Coefficient:± 150ppm/°C; Automotive Qualification Standard:AEC-Q200; SVHC:No SVHC (27-Jun-2018)
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    • CURRENT SENSE RES, 0R0025, 2%, 660 MW; Resistance:0.0025ohm; Product Range:PML Series; Resistor Case Style:0805 Wide; Power Rating:660mW; Resistance Tolerance:± 2%; Resistor Element Material:Metal Strip; Temperature Coefficient:± 200ppm/°C; Automotive Qualification Standard:AEC-Q200; SVHC:No SVHC (27-Jun-2018)
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    • CAP, 6800µF, 450V, ALU ELEC, SCREW; Capacitance:6800µF; Voltage Rating:450V; Product Range:ALS31 Series; Lifetime @ Temperature:20000 hours @ 85°C; Capacitance Tolerance:± 20%; Capacitor Terminals:Screw; Diameter:77mm; Lead Spacing:31.8mm; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; Height:220mm; ESR:0.021ohm; Automotive Qualification Standard:-; SVHC:No SVHC (15-Jan-2018)
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  • KEMET
    • REF DESIGN BRD, COMMUNICATION PROCESSOR; Silicon Manufacturer:NXP; Silicon Core Number:LS1043A; Kit Application Type:Communication & Networking; Application Sub Type:Communication Processor; Core Architecture:ARM; Core Sub-Architecture:Cortex-A53; Silicon Family Name:QorIQ; Kit Contents:Reference Design Board LS1043A; Product Range:-; SVHC:No SVHC (15-Jan-2019)
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  • NXP
    • of I/O's:293I/O's; MCU Case Style:MAPBGA; No.

    of I/O's:293I/O's; MCU Case Style:MAPBGA; No.

    Nxp Spc5775Edk3Mme3.5V; MCU Family:MPC5xxx; MCU Series:MPC57xx; Automotive Qualification Standard:-; MSL:MSL 3 - 168 hours; SVHC:No SVHC (15-Jan-2019) MCU, 32BIT, 264MHZ, MAPBGA-416; Product Range:MPC5xxx Family MPC57xx Series Microcontrollers; Architecture:Power Architecture; MCU Core Size:32bit; Program Memory Size:4MB; RAM Memory Size:512KB; CPU Speed:264MHz; No.

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    • of I/O's:293I/O's; MCU Case Style:MAPBGA; No.
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  • NXP
    • STRUCTURAL ADHESIVE, ACYLIC, 80ML; Adhesive Type:Acrylic; Adhesive Colour:Cream; Cure:Room Temperature; Tensile Strength:2900.75psi; Dispensing Method:Bottle; Volume:80ml; Weight:-; Product Range:-; SVHC:No SVHC (15-Jan-2018)
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    • of I/O's:293I/O's; MCU Case Style:MAPBGA; No.

    of I/O's:293I/O's; MCU Case Style:MAPBGA; No.

    Nxp Spc5775Bdk3Mme2.5V; Supply Voltage Max:5.

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  • NXP
    • STRUCTURAL ADHESIVE, ACYLIC, 80ML; Adhesive Type:Acrylic; Adhesive Colour:Cream; Cure:Room Temperature; Tensile Strength:2900.75psi; Dispensing Method:Bottle; Volume:80ml; Weight:-; Product Range:-; SVHC:No SVHC (15-Jan-2018)
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